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It is possible to observe cross-sections while observing FIB processing in real time.
A new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.
![[Data] Cross-sectional observation of solar cell modules](https://image.www.ipros.com/public/product/image/cc1/2000561879/IPROS02201267418243097889.png?w=280&h=280)
We have published cross-sectional observations of the fracture surface and elemental maps of the fracture area!
This document introduces the cross-sectional observation of solar cell modules. After inspecting the solar cell module that underwent thermal shock testing, cross-sectional observations were conducted at the identified areas of abnormality, confirming that the interconnector solder joint had fractured. 【Contents】 ■ Cross-sectional observation of the fracture ■ Elemental map of the fracture *For more details, please refer to the PDF document or feel free to contact us.
It is possible to grasp the shape and see approximate dimensions! Strongly supports manufacturing.
At our company, regardless of the lenses or lens units, we can understand the shape and approximate dimensions through cross-sectional observation. For products that fit within approximately φ3cm × 3cm, we are open to consultations regarding measuring specified areas, from resin solidification to cut samples, if requested. Tokyo Shinbi Optical Electronics strongly supports your manufacturing with various experiences and know-how cultivated in micro-lens development. 【Case Overview】 ■ Measurement Items ・Cross-sectional observation ・Dimension measurement ■ Measuring Instruments ・Polishing machine "Struers TegraSystem" ・Measuring microscope "Nikon MM-800/LFA" *For more details, please refer to the PDF document or feel free to contact us.
